10.22
A Simple Technique for Removing the Entire Metallization Stack for Sub 100nm Device Technologies
A Simple Technique for Removing the Entire Metallization Stack for Sub 100nm Device Technologies
Monday, November 4, 2013
The Tech Museum
Summary:
This paper will present a simple and quick polishing method that will remove the entire metallization stack above metal 1 for 55nm technology devices resulting in significantly reducing the time needed to reach the transistor level of the device and also greatly improving planarity across the device. This method does not allow for the inspection of individual metal layers above metal 1, but is intended for those cases in which gaining access to the transistor layer is required for electrical characterization and physical analysis.
This paper will present a simple and quick polishing method that will remove the entire metallization stack above metal 1 for 55nm technology devices resulting in significantly reducing the time needed to reach the transistor level of the device and also greatly improving planarity across the device. This method does not allow for the inspection of individual metal layers above metal 1, but is intended for those cases in which gaining access to the transistor layer is required for electrical characterization and physical analysis.