39th International Symposium for Testing and Failure Analysis (November 3 – 7, 2013)
November 03 - 07, 2013
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Chip Scale Package and Its Failure Analysis Challenges
Sunday, November 3, 2013: 8:00 AM
Meeting Room 230A (San Jose McEnery Convention Center)
Ms. Susan Li
,
Spansion Inc, Sunnyvale, CA
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Package and Physical FA
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