Package and Physical FA

Sunday, November 3, 2013: 8:00 AM-1:15 PM
Meeting Room 230A (San Jose McEnery Convention Center)
Session Chairs:
Mr. Jake E. Klein and Mr. Chris Richardson
8:00 AM
Chip Scale Package and Its Failure Analysis Challenges
Ms. Susan Li, Spansion Inc
9:00 AM
SAM Vs X-RAY
Dr. Thomas M. Moore, Omniprobe, Inc.
10:00 AM
Break
10:15 AM
Non-Destructive 3D X-Ray Microscopy to Complement Physical Cross-Section in the Failure Analysis and Package Development Workflows
Mr. Luke Hunter, Carl Zeiss X-ray Microscopy; Mr. Yuri Sylvester, Carl Zeiss X-ray Microscopy; Dr. Bruce Johnson, Carl Zeiss X-ray Microscopy; Dr. Tulip Chou, Taiwan Semiconductor Manufacturing Company
11:15 AM
Lunch
12:15 PM
Flip-Chip and Backside Analysis Techniques
Dr. Edward I. Cole Jr., Sandia National Laboratories; Dr. Daniel Barton, Sandia National Laboratories; Ms. Karoline Bernhard-Hofer, Infineon
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