Mr. Steven B. Herschbein
Mr. Steven B. Herschbein
IBM Systems & Technology
Hudson Valley Research Park
2070 Rt 52, B/300, MS-4A1
Hopewell Junction,
NY
USA
12533
Papers:
4.3
Silicon & Package Preparation Options for Focused Ion Beam (FIB) Circuit Editing & General Packaging Failure Analysis
Focused Ion Beam (FIB) for Circuit Edit, Fault Isolation and Sample Preparation