Mr. HoonYen Gwee
Mr. HoonYen Gwee
Chief Failure Analysis Engineer
INFINEON TECHNOLOGIES
Quality Management Department/ Failure Analysis
Free trade Zone, Batu Berendam.
Malacca
Malaysia
75350
Papers:
A Sample Preparation on Decapsulation Methodology for Effective Failure Analysis on Thin Small Leadless (TSLP) Flip Chip Package with Copper Pillar (CuP) Bump Interconnect Technology