40th International Symposium for Testing and Failure Analysis (ISTFA 2014): At-A-Glance
40th International Symposium for Testing and Failure Analysis (ISTFA 2014): At-A-Glance
SUNDAY November 9
Tutorial
AM
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Yield Basics for FA Tutorial8:00 AM-9:00 AM
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Beam-Based Defect Localization Tutorial9:00 AM-10:00 AM
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SAM vs X-RAY Tutorial9:00 AM-10:00 AM
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Testing Small Technology Nodes in 2, 2.5, 3, and 5.5D Tutorial9:00 AM-10:00 AM
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Flip-Chip and Backside Techniques Tutorial10:15 AM-11:15 AM
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Photonic Localization Techniques Tutorial10:15 AM-11:15 AM
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The Role of Nanoprobing in Yield and Failure Analysis Tutorial10:15 AM-11:15 AM
PM
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Defect localization by Lock-in-Thermography Tutorial12:15 PM-1:15 PM
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Scanning Electron Microscopy Tutorial1:15 PM-2:15 PM
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Emerging Failure Modes of Advanced Technology Tutorial2:15 PM-3:15 PM
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Magnetic Imaging for Die and Package Fault Isolation Tutorial2:15 PM-3:15 PM
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Transmission Electron Microscopy Tutorial2:15 PM-3:15 PM
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Failure Anamnesis (be)for(e) Failure Analysis Tutorial3:15 PM-4:15 PM
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Ultra-High Resolution in the SEM Tutorial3:15 PM-4:15 PM
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Materials Characterization for Failure Analysis Tutorial5:30 PM-6:30 PM
MONDAY November 10
Symposium
AM
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Plenary Session8:00 AM-9:40 AM
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Emerging Concepts and Techniques9:55 AM-11:15 AM
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Novel Research-Level Techniques and Concepts11:15 AM-12:05 PM
PM
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Detecting Counterfeit Devices1:00 PM-1:25 PM
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3D Packages I1:00 PM-2:40 PM
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Photon-Based Techniques I1:25 PM-2:40 PM
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Packaging and Assembly Analysis I2:50 PM-4:05 PM
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Photon-Based Techniques II2:50 PM-4:05 PM
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Contactless User Group4:05 PM-6:00 PM
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Social Event7:00 PM-9:00 PM
TUESDAY November 11
Symposium
AM
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Microscopy I8:00 AM-9:15 AM
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3D Packages II8:00 AM-9:40 AM
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Electrical Characterization and Nanoprobing9:55 AM-12:00 PM
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Packaging and Assembly Analysis II9:55 AM-12:00 PM
PM
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Nanoprobing User Group12:20 PM-2:20 PM
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Packaging and Assembly Analysis III2:35 PM-3:50 PM
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Case Studies and the Failure Analysis Process I2:35 PM-4:40 PM
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Expo Networking Reception4:00 PM-6:00 PM
WEDNESDAY November 12
Symposium
AM
PM
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Posters1:30 PM-3:30 PM
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Circuit Edit3:30 PM-4:20 PM
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Sample Preparation and Device Deprocessing I3:30 PM-5:35 PM
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Microscopy II4:20 PM-6:00 PM
Tutorial
AM
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Fundamentals of Laser Signal Injection Microscopy9:00 AM-10:00 AM
THURSDAY November 13
Symposium
AM
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Case Studies and the Failure Analysis Process II8:00 AM-9:40 AM
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Sample Preparation and Device Deprocessing II8:00 AM-9:40 AM
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Defect Characterization and Metrology9:50 AM-11:30 AM
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Sample Preparation and Device Deprocessing III9:50 AM-11:55 AM
PM
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Sample Prep User Group12:20 PM-2:20 PM
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Sample Preparation and Device Deprocessing IV2:30 PM-3:20 PM
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Software-Based Techniques, Test, Diagnosis, and Yield2:30 PM-3:45 PM
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FIB User Group3:45 PM-5:45 PM