Mr. Hua Feng

Engineer
GLOBALFOUNDRIES Singapore Pte. Ltd
TD-NTP-PSE
60 Woodlands Industrial Park D Street 2 Singapore
Singapore Singapore 738406

Papers:
Investigation of Protection Layer Materials for Ex-situ 'lift-out' TEM sample Preparation Technique with FIB for 14nm FinFET Application of Fast Laser Deprocessing Techniques in Physical Failure Analysis on SRAM Memory of Advance Technology