FIB on PCB Board

Wednesday, November 9, 2016
Mr. Joshua G Adams , Intel Corporation, Folsom, CA
Mr. Calvin R Ball , Intel Corporation, Folsom, CA
Mr. Tim McCready , Intel Corporation, Folsom, CA
Mr. Eiji Suzuki , Intel Corporation, Folsom, CA
Mrs. Sonya Robertson , Intel Corporation, Folsom, CA

Summary:

This paper presents a solution to RF signal degradation on RF edits caused by test socket loss by first soldering the device to the test board and then preforming the FIB. Eliminating the need for difficult sample preparation on ultra thinned devices and allowing for multiple FIB circuit edits to be preformed during the test FIB edit cycle.