FIB on PCB Board
FIB on PCB Board
Wednesday, November 9, 2016
Summary:
This paper presents a solution to RF signal degradation on RF edits caused by test socket loss by first soldering the device to the test board and then preforming the FIB. Eliminating the need for difficult sample preparation on ultra thinned devices and allowing for multiple FIB circuit edits to be preformed during the test FIB edit cycle.
This paper presents a solution to RF signal degradation on RF edits caused by test socket loss by first soldering the device to the test board and then preforming the FIB. Eliminating the need for difficult sample preparation on ultra thinned devices and allowing for multiple FIB circuit edits to be preformed during the test FIB edit cycle.