Perfecting Large Area, High Resolution SEM Imaging with 3D-Stitching for Integrated Circuit Reverse Engineering
Perfecting Large Area, High Resolution SEM Imaging with 3D-Stitching for Integrated Circuit Reverse Engineering
Monday, November 7, 2016: 2:25 PM
113 (Fort Worth Convention Center)
Summary:
IC reverse engineering benefits by combining the resolution and flexibility of the SEM instrument with the accuracy, stability, and automation of the electron beam lithography (EBL) instrument.
IC reverse engineering benefits by combining the resolution and flexibility of the SEM instrument with the accuracy, stability, and automation of the electron beam lithography (EBL) instrument.