Perfecting Large Area, High Resolution SEM Imaging with 3D-Stitching for Integrated Circuit Reverse Engineering

Monday, November 7, 2016: 2:25 PM
113 (Fort Worth Convention Center)
Mr. Joel Fridmann , Raith America, Inc., Troy, NY
Dr. Jason Sanabia , Raith America, Inc., Troy, NY
Mr. Martin Rasche , Raith GmbH, Dortmund, Germany

Summary:

IC reverse engineering benefits by combining the resolution and flexibility of the SEM instrument with the accuracy, stability, and automation of the electron beam lithography (EBL) instrument.
See more of: Reverse Engineering I
See more of: Technical Program