42nd International Symposium for Testing and Failure Analysis (November 6-10, 2016)
November 06 - 10, 2016
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Chip Scale Packaging and Its Failure Analysis Challenges
Sunday, November 6, 2016: 8:00 AM
110B (Fort Worth Convention Center)
Ms. Susan Li
,
Cypress Semiconductor, San Jose, CA
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Package and Physical Analysis Challenges I
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Tutorial