How to achieve artefact-free FIB milling on polyimide packages

Tuesday, November 8, 2016: 1:55 PM
110AB (Fort Worth Convention Center)
Dr. Tomas Hrncir , TESCAN Brno s.r.o., Brno, Czech Republic
Mr. Marek Sikula , TESCAN Brno s.r.o., Brno, Czech Republic
Mr. Pascal Gounet , STMicroelectronics, Grenoble, France
Dr. Jozef Vincenc Obona , TESCAN Brno s.r.o., Brno, Czech Republic

See more of: Package and Physical Analysis Challenges II
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