Package and Physical Analysis Challenges II

Tuesday, November 8, 2016: 1:30 PM-2:20 PM
110AB (Fort Worth Convention Center)
Session Chair:  Mr. G. B. Anderson, Failure Analysis, Infineon Technologies, Livonia, MI
1:30 PM
Effective Laser Decapsulation Employing the Digital ICO Laser and HAZ-Methodology
Mr. G. B. Anderson, Infineon Technologies; Mr. Lance Fordham, Control Laser Corporation
1:55 PM
How to achieve artefact-free FIB milling on polyimide packages
Dr. Tomas Hrncir, TESCAN Brno s.r.o.; Mr. Marek Sikula, TESCAN Brno s.r.o.; Mr. Pascal Gounet, STMicroelectronics; Dr. Jozef Vincenc Obona, TESCAN Brno s.r.o.
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