42nd International Symposium for Testing and Failure Analysis (November 6-10, 2016)
November 06 - 10, 2016
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Dr. Michael DiBattista
Qualcomm Technologies, Inc
SAN DIEGO, CA
USA 92121
Papers:
Electrical Invasiveness of Grinding and Polishing Advanced Silicon Integrated Circuits to Ultra-thin Remaining Silicon Thickness
Measuring the Performance Effects of Diffusion Exposure by FIB