Electrical Invasiveness of Grinding and Polishing Advanced Silicon Integrated Circuits to Ultra-thin Remaining Silicon Thickness

Monday, November 7, 2016: 1:50 PM
108 (Fort Worth Convention Center)
Dr. Robert D. Chivas , Varioscale, Inc, San Marcos, CA
Mr. Scott Silverman , Varioscale, Inc, San Marcos, CA
Dr. Ulrike Kindereit , Qualcomm Technologies, Inc, SAN DIEGO, CA
Dr. Michael DiBattista , Qualcomm Technologies, Inc, SAN DIEGO, CA

See more of: Sample Preparation and Device Deprocessing
See more of: Technical Program