Failure Analysis and Process Verification of High Density Copper ICs used in Multi-Chip Modules (MCM)

Thursday, November 9, 2017: 3:35 PM

Ballroom A (Pasadena Convention Center)

Mr. Jeremy A. Walraven , Sandia National Laboratories, Albuquerque, NM

Mr. Mark Jenkins , Sandia National Laboratories, Albuquerque, NM

Dr. Edward I. Cole Jr. , Sandia National Laboratories, Albuquerque, NM

Mrs. Tuyet N. Simmons , Sandia National Laboratories, Albuquerque, NM

Mr. James L. Levy , Sandia National Laboratories, Mixed Signal ASIC/SoC Products, Albuquerque, NM

Dr. Sarah E. Jensen , Sandia National Laboratories, MESA Fabrication Operations, Albuquerque, NM

Dr. Adam Jones , Sandia National Laboratories, MESA Fabrication Operations, Albuquerque, NM

Mr. Eric E. Edwards , Sandia National Laboratories, Mixed Signal ASIC/SoC Products, Albuquerque, NM

Dr. James A. Bartz , Sandia national Laboratories, R&D Electrical Engineering, Albuquerque, NM

Mr. Lovelace Soirez , Novati Technologies, Austin, TX

Mr. John Norbert , Novati Technologies, Austin, TX