Highly Resolved Ultrasonic Inspection Images of Semiconductor Packages by Advanced High-frequency Transducers

Monday, November 6, 2017: 1:35 PM
Ballroom C (Pasadena Convention Center)
Mr. Koutaro Kikukawa , Hitachi Power Solutions Co., Ltd., Hitachinaka, Ibaraki, Japan
Mr. Kenta Sumikawa , Hitachi Power Solutions Co., Ltd., Hitachinaka, Ibaraki, Japan
Mr. Takuya Takahashi , Hitachi Power Solutions Co., Ltd., Hitachinaka, Ibaraki, Japan
Dr. Shigeru Ohno , Hitachi Power Solutions Co., Ltd., Hitachinaka, Ibaraki, Japan

Summary:

This paper describes the method to obtain the highly resolved ultrasonic inspection images of semiconductor packages. We evaluated the influence of the incident ultrasonic frequency to the resolution and failure detectability. When the nominal frequency of the ultrasonic transducers was changed from 300 MHz to 400 MHz, the failure detectability was improved from 2.5 μm to 1.0 μm. The observed images of semiconductor packages proved that 400 MHz transducer is actually applicable to the inspection of sophisticated LSIs.
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