Packaging and Assembly Level FA

Monday, November 6, 2017: 12:20 PM-2:25 PM
Ballroom C (Pasadena Convention Center)
Dr. Wentao Qin, ON Semiconductor and Dr. Peng Li, Intel Corporation
12:20 PM
Use of 3D Xray Microscopy for BEOL and Advanced Packaging Failure Analysis
Dr. Christian Schmidt, Carl Zeiss X-Ray Microscopy, Inc.; Dr. Stephen T. Kelly, Carl Zeiss X-Ray Microscopy, Inc.; Prof. Ingrid De Wolf, imec
12:45 PM
Advanced In Situ X-ray Metrology for Thermal Interface Materials Package Failure Analysis
Dr. Peng Li, Intel Corp.
1:10 PM
Influence of Sample Preparation on Intrinsic Stress inside a Model Chip, comparison of Results from Electric Read-Out and Raman Spectroscopy.
Mr. Tim Schaffus, Infineon Technologies AG
1:35 PM
Highly Resolved Ultrasonic Inspection Images of Semiconductor Packages by Advanced High-frequency Transducers
Mr. Koutaro Kikukawa, Hitachi Power Solutions Co., Ltd.; Mr. Kenta Sumikawa, Hitachi Power Solutions Co., Ltd.; Mr. Takuya Takahashi, Hitachi Power Solutions Co., Ltd.; Dr. Shigeru Ohno, Hitachi Power Solutions Co., Ltd.
2:00 PM
Magnetic Field Imaging on Stacked Flash Memories by Laser Probing (MOFM) and SQUID Scanning (MCI)
Dr. Kevin Sanchez, CNES - French Space Agency; Dr. Nicolas Courjault, Intraspec Technologies; Dr. Guillaume Bascoul, Centre National d'Etudes Spatiales (CNES); Mr. Fulvio infante, Instraspec Technologies
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