Acoustic and Photoacoustic Inspection of Through-Silicon Vias in the GHz-frequency band

Monday, November 6, 2017: 9:40 AM
Ballroom D (Pasadena Convention Center)
Dr. Sebastian Brand , Fraunhofer Institute for Microstructure of Materials and Systems, Halle, Germany
Mr. Michael Kögel , Fraunhofer Institute for Microstructure of Materials and Systems, Halle, Germany
Mr. Ahmad Khaled , IMEC, Leuven, Belgium
Prof. Ingrid DeWolf , IMEC, Leuven, Belgium
Mr. Michael J. Moore , Ryerson University, Toronto, ON, Canada
Dr. Eric Strohm , University of Toronto, Toronto, ON, Canada
Prof. Michael C. Kolios , Ryerson University, Toronto, ON, Canada
Mr. Frank Altmann , Fraunhofer Institute for Microstructure of Materials and Systems, Halle, Germany

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