Emerging FA Techniques and Concepts
Monday, November 6, 2017: 9:40 AM-11:20 AM
Ballroom D (Pasadena Convention Center)
Prof. Christian Boit, Technical University of Berlin and Mr. Dan Bodoh, NXP Semiconductors
9:40 AM
Acoustic and Photoacoustic Inspection of Through-Silicon Vias in the GHz-frequency band
Dr. Sebastian Brand, Fraunhofer Institute for Microstructure of Materials and Systems;
Mr. Michael Kögel, Fraunhofer Institute for Microstructure of Materials and Systems;
Mr. Ahmad Khaled, IMEC;
Prof. Ingrid DeWolf, IMEC;
Mr. Michael J. Moore, Ryerson University;
Dr. Eric Strohm, University of Toronto;
Prof. Michael C. Kolios, Ryerson University;
Mr. Frank Altmann, Fraunhofer Institute for Microstructure of Materials and Systems
