A Study on the cause and improvement method of Aluminum PAD disappearance defect in TSV Package process

Wednesday, November 8, 2017
Mr. Boem-Su Kim , SK Hynix, Icheon, Korea, Republic of (South)
Mr. Su Hyeon Park , SK Hynix, Icheon, Korea, Republic of (South)
Mr. Hyoung Ryeun Kim , SK Hynix, Icheon, Korea, Republic of (South)
Mr. Sung Min Hwang , SK Hynix, Icheon, Korea, Republic of (South)

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