3D Devices Failure Analysis - Poster

Wednesday, November 8, 2017: 1:30 PM-3:30 PM

Ms. Claudia Keller, Infineon Technologies Munich and Dr. Christian Schmidt, Carl Zeiss X-Ray Microscopy, Inc.

Study on development behavior and mechanism of delamination by NCF material under uHAST Condition
Ms. Ju Young KIM, SK Hynix; Mr. Hyoung Ryeun Kim, SK Hynix; Mr. Sung Min Hwang, SK Hynix

Temperature dependent die warpage measurements up to 400°C
Mr. Tobias Mittereder, Infineon Technoliges

A Study on the cause and improvement method of Aluminum PAD disappearance defect in TSV Package process
Mr. Boem-Su Kim, SK Hynix; Mr. Su Hyeon Park, SK Hynix; Mr. Hyoung Ryeun Kim, SK Hynix; Mr. Sung Min Hwang, SK Hynix

See more of: Technical Program