3D Localization of liner breakdown’s within Cu filled TSV´s by backside LIT and PEM defocusing series

Monday, November 6, 2017: 3:25 PM
Ballroom A (Pasadena Convention Center)
Mr. Frank Altmann , Fraunhofer Institute for Microstructure of Materials and Systems IMWS, Halle, Germany
Mr. Christian Grosse , Fraunhofer Institute for Microstructure of Materials and Systems IMWS, Halle, Germany
Mrs. Ingrid de Wolf , Imec, Leuven, Belgium
Dr. Sebastian Brand , Fraunhofer Institute for Microstructure of Materials and Systems IMWS, Halle, Germany

Summary:

The paper demonstrates an enhanced inspection technique employing backside LIT and PEM for detecting resistive liner breakdowns within Cu filled TSVs of small diameters and for localizing the defects depth by performing a defocusing sequence.
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