3D Devices Failure Analysis

Monday, November 6, 2017: 3:00 PM-4:40 PM
Ballroom A (Pasadena Convention Center)
Dr. Christian Schmidt, Carl Zeiss X-Ray Microscopy, Inc. and Ms. Claudia Keller, Infineon Technologies Munich
3:00 PM
STUDENT PAPER: Making synchrotron tomography a routine tool for 3D integration failure analysis through a limited number of projections, an adapted sample preparation scheme, and a fully-automated post-processing
Ms. Alexandra fraczkiewicz, CEA, LETI, MINATEC Campus; Mr. Pierre-Olivier Autran, ESRF; Dr. Ennio Capria, ESRF; Dr. Peter Cloetens, ESRF; Dr. Julio Da silva, ESRF; Dr. Sandrine Lhostis, STMicroelectronics; Dr. Frederic Lorut, STMicroelectronics; Dr. Stéphane Moreau, Univ. Grenoble Alpes; Thierry Mourier, Univ. Grenoble Alpes; Dr. Pierre Bleuet, Univ. Grenoble Alpes
3:25 PM
3D Localization of liner breakdown’s within Cu filled TSV´s by backside LIT and PEM defocusing series
Mr. Frank Altmann, Fraunhofer Institute for Microstructure of Materials and Systems IMWS; Mr. Christian Grosse, Fraunhofer Institute for Microstructure of Materials and Systems IMWS; Mrs. Ingrid de Wolf, Imec; Dr. Sebastian Brand, Fraunhofer Institute for Microstructure of Materials and Systems IMWS
3:50 PM
Non-Destructive Fault Localization in 2.5D Packages Using Electro Optical Terahertz Pulse Reflectometry
Ms. Bernice Zee, AMD; Mr. W Qui, AMD; Dr. Jesse Alton, TeraView Limited; Dr. Thomas White, TeraView Limited; Mr. Martin Igarashi, TearView Limited
4:15 PM
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