Application of Conductive-AFM in Soft Failure Analysis

Wednesday, November 8, 2017
Dr. Chuan Zhang , GLOBALFOUNDRIES Inc., Malta, NY
Mr. Yinzhe Ma , GLOBALFOUNDRIES Inc., Malta, NY
Mr. Gregory Dabney , GLOBALFOUNDRIES Inc., Malta, NY
Mr. Chong Khiam Oh , GLOBALFOUNDRIES Inc., Malta, NY
Ms. Esther P.Y. Chen , GLOBALFOUNDRIES Inc., Malta, NY

Summary:

The root-cause of soft failures at leading-edge nodes become more and more challenging to identify. By inserting CAFM into the soft failure analysis flow, success rate of such type of analysis can be significantly enhanced. In this paper, a logic chain soft failure and a SRAM local bitline soft failure will be used as examples to illustrate how this FA methodology provides a powerful and efficient solution for soft failure analysis.