A QUANTITATIVE METHOD FOR MEASURING REMAINING SILICON THICKNESS DURING XEF2 FIB TRENCHING FOR BACKSIDE CIRCUIT OPERATIONS

Thursday, November 9, 2017: 2:45 PM
Ballroom C (Pasadena Convention Center)
Mr. Gregory Salazar , Sandia National Laboratories, Albuquerque, NM
Dr. Randy Shul , Sandia National Laboratories, Albuquerque, NM
Mr. Steven Ball , Sandia National Laboratories, Albuquerque, NM
Mr. Michael Rye , Sandia National Laboratories, Albuquerque, NM
Dr. Brian Phillips , Sandia National Laboratories, Albuquerque, NM
Dr. Michael DiBattista , Varioscale, San Marcos, CA
Dr. Scott Silvermann , Varioscale, San Marcos, CA

See more of: FIB Circuit Analysis and Edit
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