Ultra-low frequency laser voltage imaging of mixed-signal designs

Wednesday, November 8, 2017: 8:25 AM
Ballroom A (Pasadena Convention Center)
Dr. Tobias Schmidutz , Infineon Technologies, Neubiberg, Germany

Summary:

During the last years laser reflectance modulation measurements (i.e. LVI, CW-SIP etc.) have become indispensable tools for analysis of logic circuits at frequencies in the megahertz range. In this paper we present a method to extend the usefulness of these methods to mixed signal circuits driven at ultra-low frequencies in the kilohertz range. We show that by toggling the main power-supply, information of the electric behavior can be easily obtained from analog structures, removing the need for tester-based stimulation. This method proved especially fruitful for the debugging of chip start-up failures. We demonstrate this on a case where a defect in the analog chip part shuts down the digital part of the chip, thus preventing methods such as the read-out of error registers or the use of scan chains. Conventional methods like photon emission microscopy and thermal laser stimulation were not successful at finding the problem. Laser-voltage imaging (LVI) of the analog circuit at key locations while toggling the chip power supply in the kilohertz range led directly to the failing net.
See more of: Fault Isolation I
See more of: Technical Program