Overcoming the challenges on Electrically Damaged Devices

Thursday, November 9, 2017: 10:15 AM
Ballroom A (Pasadena Convention Center)
Mr. Andrew Sabate , On-semiconductor, Oudenaarde, Belgium
Mr. Allan Norico , On-semiconductor, Oudenaarde, Belgium

Summary:

Electrical damage devices can mask out the judgement of an analyst in finding the genuine failure mechanism. With proper identification of electrical damage location correlating it with schematic, layout and electrical results the real root cause can be determined. Backside IR mapping of electrically damaged devices sometimes help to locate the hidden true failure mechanism. And it also helps to have a better visualization of the patterns/images to better understand the sequence of damages.