FA Processes Case Studies I

Thursday, November 9, 2017: 9:50 AM-12:20 PM
Ballroom A (Pasadena Convention Center)
Dr. Andreas Meyer, Globalfoundries Fab 1 and Dr. James J. Demarest, IBM
9:50 AM
A review of junction defect isolation methods
Mr. Gregory M. Johnson, GLOBALFOUNDRIES; Mr. Christopher D'Aleo, GLOBALFOUNDRIES; Mr. Jocho Nxumalo, GLOBALFOUNDRIES; Mr. Brian Yates, GLOBALFOUNDRIES; Mr. Zaheer Khan, GLOBALFOUNDRIES; Mr. Christopher Molella, GLOBALFOUNDRIES
10:15 AM
Overcoming the challenges on Electrically Damaged Devices
Mr. Andrew Sabate, On-semiconductor; Mr. Allan Norico, On-semiconductor
10:40 AM
Conductive-AFM for Failure Analysis of Parametric Test Structures in Advanced Technology Development
Dr. Chuan Zhang, GLOBALFOUNDRIES Inc.; Ms. Esther P.Y. Chen, GLOBALFOUNDRIES Inc.
11:05 AM
Fast Root Cause Identification with Combination of Failure Analysis and In-line Inspection
Dr. Zhigang Song, GLOBALFOUNDRIES; Dr. Weihao Weng, GLOBALFOUNDRIES Inc.; Mr. Brett Engel, GLOBALFOUNDRIES Inc.
11:30 AM
SRAM PFET and NFET super FIN characterization
Dr. Yong Wei, GLOBALFOUNDRIES Inc.; Dr. Frieder Baumann, GLOBALFOUNDRIES Inc.; Mr. Steve Lucarini, GLOBALFOUNDRIES Inc.; Dr. Zhigang Song, GLOBALFOUNDRIES; Dr. Ahmad Katnani, GLOBALFOUNDRIES Inc.
11:55 AM
A Case Study of Trapped Charge Induced Surface Leakage
Mr. Xiang-Dong Wang, NXP Semiconductors N.V.; Xu Cheng, NXP Semiconductors N.V.; Evgueniy Stefanov, NXP Semiconductors N.V.; William Godek, NXP Semiconductors N.V.
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