43rd International Symposium for Testing and Failure Analysis (November 5-9, 2017): http://www.asminternational.org/web/istfa-2017/home

43rd International Symposium for Testing and Failure Analysis (November 5-9, 2017)
November 05 - 09, 2017

  • Home
  • Start
  • Browse
    • Browse by Day
  • At-A-Glance
  • Author Index

Mr. Chung-Ching Tsai

Technologist
Faraday Technology Corp.
IC Technology
Hsin Chu Taiwan 300

Papers:

STUDENT PAPER: The Failure Mechanism study of Single Metal Contact Open Induced Scan Chain Failure in 90nm node VLSI Using Electron Beam Absorb Current (EBAC) Technology.

  • Home
  • Start
  • Browse
    • Browse by Day
  • At-A-Glance
  • Author Index
General Information

November 05 - 09, 2017


Pasadena, CA