43rd International Symposium for Testing and Failure Analysis (November 5-9, 2017)
November 05 - 09, 2017
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Mr. Chin-Chih Yeh
Macronix International Co., Ltd.
Hsin-chu Taiwan 300
Papers:
In situ Carbon Deposition in FIB for Reducing TEM Lamella Curtains Caused by Air-gaps of 1X-nm NAND Flash Memory