Sample Preparation and Device Deprocessing - Poster

Wednesday, November 8, 2017: 1:30 PM-3:30 PM
Dr. Erwin Hendarto, Silicon Labs and Dr. Yuanjing Li, nVIDIA Corporation
Techniques in Extracting CSP Device from Underfilled PCB Module and Performing Solder Rework and Reballing for ATE Testing
Mr. Kah Chin Cheong, ON Semiconductor; Mr. Mark Lapierre, ON Semiconductor
Uncover the underneath hidden defects through fast selective chemical etching in wafer fabrication
Ms. Ng Hui Peng, GLOBALFOUNDRIES Singapore Pte Ltd
Advanced tools and techniques for delayering and cross-sectioning of semiconductor devices
Dr. PAWEL NOWAKOWSKI, E.A. Fischione Instruments, Inc.; Ms. Mary Ray, E.A. Fischione Instruments, Inc.; Mr. Paul Fischione, E.A. Fischione Instruments, Inc.; Dr. Cecile S. Bonifacio, E.A. Fischione Instruments, Inc.
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