3D-IC / Package / Sample Prep User Group

Wednesday, November 8, 2017: 5:40 PM-7:40 PM
Ballroom B (Pasadena Convention Center)
Mr. Timothy Hazeldine1, Ashraf Rezaie2 and Dr. Nathan Bakken, PhD2, (1)ULTRA TEC Manufacturing, Inc.(2)Intel Corporation
5:40 PM
Scott Silverman: Rapid Re-packaging of Die for Backside Physical Failure Analysis
6:00 PM
Jim Colvin: Thin, Smooth and Curvy — the Confessions of a Sample Prep Specialist
6:20 PM
Erik Jordan: Effective Microwave Induced Plasma Decapsulation for Advanced IC Packages
6:40 PM
Charles Ladwig: Wire bond connected HBM (high bandwidth memory) attach on FPBGA (3d stacked die) for physical debug sample prep
See more of: Technical Program
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