44th International Symposium for Testing and Failure Analysis (Oct. 28 - Nov. 1, 2018)
October 28 - November 01, 2018
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Dr. Allen Gu
ZEISS SMT Process Control Solutions
Pleasanton, CA
USA 94588
Papers:
Non-Destructive 3D Failure Analysis Workflow for Electrical Failure Analysis in Complex 2.5D-Based Devices Combining 3D Magnetic Field Imaging and 3D X-Ray Microscopy