Dr. Sebastian Brand

Fraunhofer Institute for Microstructure of Materials and Systems IMWS
Center for Applied Microstructure Diagnostics (CAM)
Halle Germany 06120

Papers:

Detection of local Cu-to-Cu bonding defects in wafer-to-wafer hybrid bonding using GHz-SAM.
Non-Destructive Visualization of bond pad cratering defects using acoustic microscopy in the GHz-band
Defect localization by Lock-in-Thermography