Detection of local Cu-to-Cu bonding defects in wafer-to-wafer hybrid bonding using GHz-SAM.

Tuesday, October 30, 2018: 1:25 PM
226BC (Phoenix Convention Center)
Prof. Ingrid De Wolf , KU Leuven, Leuven, Belgium
Mr. Ahmad Khaled , KU Leuven, Leuven, Belgium
Dr. Soon-Wook Kim , IMEC, Leuven, Belgium
Dr. Eric Beyne , IMEC, Leuven, Belgium
Mr. Michael Kögel , Fraunhofer Institute for Microstructure of Materials and Systems IMWS, Halle, Germany
Dr. Sebastian Brand , Fraunhofer Institute for Microstructure of Materials and Systems IMWS, Halle, Germany
Dr. Tatjana Djuric , PVA Tepla Analytical Systems GmbH, Westhausen, Germany
Ingo Wiesler , PVA Tepla Analytical Systems GmbH, Westhausen, Germany

Summary:

The use of GHz-SAM for the detection of local non-bonded regions at the interface of micron-sized Cu-to-Cu pad connections within an array, in a wafer-to-wafer hybrid bonded sample, is demonstrated.
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