44th International Symposium for Testing and Failure Analysis (Oct. 28 - Nov. 1, 2018): https://www.asminternational.org/web/istfa-2018/home

44th International Symposium for Testing and Failure Analysis (Oct. 28 - Nov. 1, 2018)
October 28 - November 01, 2018

  • Home
  • Start
  • Browse
    • Browse by Day
  • At-A-Glance
  • Author Index

Ms. Chea Wee Lo

Infineon Technologies (Malaysia) Sdn Bhd
Melaka Malaysia 75350

Papers:

Investigation of Die Tilting of Packages with Single and Multi-chips
Evaluation on the Effectiveness of Removal VSON Package from FR4 Substrate Board
An Innovative Method to Enhance the Process of Front-Side Lapping for Advanced Packages

  • Home
  • Start
  • Browse
    • Browse by Day
  • At-A-Glance
  • Author Index
General Information

October 28 - November 01, 2018


Phoenix, AZ