An Innovative Method to Enhance the Process of Front-Side Lapping for Advanced Packages

Wednesday, October 31, 2018: 8:25 AM
226BC (Phoenix Convention Center)
Mr. Sze Yee Tan , Infineon Technologies (Malaysia) Sdn. Bhd., Melaka, Malaysia
Ms. Chea Wee Lo , Infineon Technologies (Malaysia) Sdn Bhd, Melaka, Malaysia

See more of: Sample Preparation and Device Deprocessing I
See more of: Technical Program