44th International Symposium for Testing and Failure Analysis (Oct. 28 - Nov. 1, 2018)
October 28 - November 01, 2018
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Ingo Wiesler
Dr.
PVA Tepla Analytical Systems GmbH
Westhausen Germany D-73463
Papers:
Detection of local Cu-to-Cu bonding defects in wafer-to-wafer hybrid bonding using GHz-SAM.
