44th International Symposium for Testing and Failure Analysis (Oct. 28 - Nov. 1, 2018): https://www.asminternational.org/web/istfa-2018/home

44th International Symposium for Testing and Failure Analysis (Oct. 28 - Nov. 1, 2018)
October 28 - November 01, 2018

  • Home
  • Start
  • Browse
    • Browse by Day
  • At-A-Glance
  • Author Index

Syahirah MD Zulkifli

Advanced Micro Devices (AMD)
Device Analysis Laboratory
Singapore Singapore

Papers:

Non-Destructive 3D Failure Analysis Workflow for Electrical Failure Analysis in Complex 2.5D-Based Devices Combining 3D Magnetic Field Imaging and 3D X-Ray Microscopy

  • Home
  • Start
  • Browse
    • Browse by Day
  • At-A-Glance
  • Author Index
General Information

October 28 - November 01, 2018


Phoenix, AZ