Fault Isolation

Sunday, October 28, 2018: 10:20 AM-5:20 PM
226A (Phoenix Convention Center)
Dr. Mayue Xie, Microsoft and Dr. Sebastian Brand, Fraunhofer Institute for Microstructure of Materials and Systems IMWS
10:20 AM
Defect localization by Lock-in-Thermography
Dr. Sebastian Brand, Fraunhofer Institute for Microstructure of Materials and Systems IMWS
11:20 AM
Photonic Localization Techniques
Prof. Christian Boit, Technische Universitaet Berlin
12:20 PM
Lunch
1:00 PM
LADA and SDL: Powerful Techniques for Marginal Failures
Mr. Dan Bodoh, NXP Semiconductors; Mr. Kent Erington, NXP Semiconductors
2:30 PM
Afternoon Refreshment Break
2:50 PM
Magnetic Imaging for Die and Package Fault Isolation
Mr. David Vallett, PeakSource Analytical, LLC
3:50 PM
FA Technique Selection for Front End Defect Localization in Bulk Semiconductor (Si) FA
Mr. Gregory M. Johnson, GLOBALFOUNDRIES
See more of: Tutorial
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