Packaging & Assembly Level FA - POSTER

Wednesday, October 31, 2018: 2:20 PM-4:20 PM
Ms. Kannu Wadhwa, Carl Zeiss and Dr. Peng Li, Intel Corp.
Electromigration Response of Microjoints in 3DIC Packaging Systems
Mr. vahid attari, Texas A&M University; Dr. Thien Duong, Texas A&M University; Dr. Raymundo Arroyave, Texas A&M University
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