Stress Analysis of Damage in Active Circuitry beneath Redistribution Layer (RDL) Bonding Pad and Improvements for Reliability
Thursday, November 14, 2019: 2:05 PM
D 137/138 (Oregon Convention Center)
Dr. Chih-Ching Shih
,
Macronix International Co. Ltd, Hsin-Chu, Taiwan
Mr. Wei-Hao Hsiao
,
Macronix International Co. Ltd, Hsin-Chu, Taiwan
Mr. Leo Chan
,
Macronix International Co. Ltd, Hsin-Chu, Taiwan
Mr. Hsiao Tien Chang
,
Macronix International Co. Ltd., Hsinchu, Taiwan
Mr. Li-Kuang Kuo
,
Macronix International Co. Ltd, Hsin-Chu, Taiwan
Mr. Ding-Jhang Lin
,
Macronix International Co. Ltd, Hsin-Chu, Taiwan
Mr. Yen-Hai Chao
,
Macronix International Co. Ltd, Hsin-Chu, Taiwan
Dr. Chih-Yuan Lu
,
Macronix International Co., Ltd., Hsin-Chu, Taiwan
