Low Power Devices Case Studies

Thursday, November 14, 2019: 2:05 PM-2:55 PM
D 137/138 (Oregon Convention Center)
Dr. Mike Bruce, Consultant and Ms. Rose Ring, Howard Hughes Research Labs, LLC
2:05 PM
Stress Analysis of Damage in Active Circuitry beneath Redistribution Layer (RDL) Bonding Pad and Improvements for Reliability
Dr. Chih-Ching Shih, Macronix International Co. Ltd; Mr. Wei-Hao Hsiao, Macronix International Co. Ltd; Mr. Leo Chan, Macronix International Co. Ltd; Mr. Hsiao Tien Chang, Macronix International Co. Ltd.; Mr. Li-Kuang Kuo, Macronix International Co. Ltd; Mr. Ding-Jhang Lin, Macronix International Co. Ltd; Mr. Yen-Hai Chao, Macronix International Co. Ltd; Dr. Chih-Yuan Lu, Macronix International Co., Ltd.
2:30 PM
Nanoprobe characterization of Soft SRAM Bit Fails in Advanced Technology
Mr. Satish Kodali, GLOBALFOUNDRIES Inc.; Mr. Chen Zhe, GLOBALFOUNDRIES Inc.; Mr. Chong Khiam Oh, Globalfoundries Inc. Malta, NY USA
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