Technical Program

Monday, November 11, 2019

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7:45 AM-10:00 AM


Opening Session/EDFAS General Meeting

10:00 AM-10:20 AM


Morning Refreshment Break

10:20 AM-12:00 PM


Emerging FA Techniques
Session Chair: Mr. Frank Altmann and Dr. Keith Serrels

12:00 PM-2:00 PM


Sample Preparation User Group
Session Chair: Mr. James (Jim) Colvin, Mr. Pradip Sairam Pichumani and Dr. Nathan Bakken, PhD

System on Package User Group
Session Chair: Dr. Lihong Cao and Prasad Divekar

2:00 PM-2:50 PM


3D Device Failure Analysis
Session Chair: Dr. Christian Schmidt and Kristofor Dickson

FIB Circuit Analysis and Edit
Session Chair: Dr. Daminda Dahanayaka and Mr. Antonio Tollis

2:50 PM-3:10 PM


Afternoon Refreshment Break

3:10 PM-4:50 PM


3D Device Failure Analysis II
Session Chair: Dr. Christian Schmidt and Kristofor Dickson

Microscopy
Session Chair: Dr. Lianfeng Fu and Mr. Ryan Fredrickson

5:00 PM-6:50 PM


Tools of the Trade Tour - Pre Registration is Required

7:00 PM-10:00 PM


Evening Social Event at the Punch Bowl

Tuesday, November 12, 2019

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8:30 AM-9:30 AM


Keynote Presentation - Exploration for Beyond CMOS Integrated Circuit Technology for Computing

9:30 AM-10:10 AM


Morning Refreshment Break

11:10 AM-11:35 AM


Nanoprobing and Electrical Characterization
Session Chair: Sweta Pendalaya and John Sanders

11:40 AM-12:05 PM


Detecting and Preventing Counterfeit Microelectronics
Session Chair: Dr. Michael Azarian and Dr. Martine Simard-Normandin

12:00 PM-1:00 PM


Lunch on the Expo Show Floor

1:00 PM-2:40 PM


FIB Sample Preparation
Session Chair: Dr. Bryan Tracy, PhD and Jake Jensen

Nanoprobing and Electrical Characterization II
Session Chair: Sweta Pendalaya and Mr. John Sanders

2:40 PM-3:20 PM


Afternoon Refreshment Break

3:20 PM-4:35 PM


Nanoprobing and Electrical Characterization III
Session Chair: Dr. Sweta Pendalaya and John Sanders

3:20 PM-5:00 PM


FIB Sample Preparation II
Session Chair: Dr. Bryan Tracy, PhD and Mr. Jake Jensen

5:00 PM-6:30 PM


Reception on the Expo Show Floor

Wednesday, November 13, 2019

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8:00 AM-9:40 AM


Packaging & Assembly
Session Chair: Ms. Kannu Wadhwa and Dr. Peng Li

9:00 AM-9:25 AM


Space Application FA and Energy
Session Chair: Dr. Zachary Lingley and John Bescup

9:25 AM-9:50 AM


SI Photonic FA
Session Chair: Dr. Felix Beaudoin and Mr. Artemisia Tsiara

9:40 AM-10:10 AM


Morning Refreshment Break

10:10 AM-11:40 AM


Panel Discussion - What Artificial Intelligence Means to Failure Analysis Engineers?

11:40 AM-1:40 PM


Lunch on the Expo Show Floor

12:10 PM-1:40 PM


Women in Failure Analysis (WEFA) - How to Fearlessly Direct Your Career Growth
Session Chair: Ms. Svetlana Leboeuf and Ms. Kannu Wadhwa

1:40 PM-2:30 PM


Fault Isolation
Session Chair: Mr. Dan Bodoh and Dr. Jesse Alton

Hardware Attacks, Security, and Reverse Engineering
Session Chair: Dr. Haoting Shen and Shahin Tajik

2:30 PM-4:30 PM


3D Device Failure Analysis - POSTER
Session Chair: Dr. Christian Schmidt and Kristofor Dickson

Emerging FA Techniques - POSTER
Session Chair: Mr. Frank Altmann and Dr. Keith Serrels

FA Processes Case Studies - POSTERS
Session Chair: Dr. Chuan Zhang and Dr. Erwin Hendarto

Fault Isolation - POSTERS
Session Chair: Mr. Dan Bodoh, Dr. Jesse Alton, Dr. Shraddha Bodhe and Ms. Lauren Blair

Microscopy - POSTERS
Session Chair: Dr. Lianfeng Fu and Mr. Ryan Fredrickson

Mixed Mode & High Power Devices Case Studies - POSTERS
Session Chair: Mr. Stephen Fasolino and Mr. Jeff Gambino

Nanoprobing and Electrical Characterization - POSTERS
Session Chair: Sweta Pendyala and John Sanders

Packaging & Assembly - POSTERS
Session Chair: Ms. Kannu Wadhwa and Dr. Peng Li

Poster and Video Dessert Reception 2:30 - 4:30 PM

Product Yield, Test & Diagnostics - POSTERS
Session Chair: Mr. Jayant DSouza and Mr. Amit Jakati

Sample Preparation and Device Deprocessing - POSTERS
Session Chair: Dr. Changqing Chen and Mr. P. K. Tan

Scanning Probing Analysis - POSTERS
Session Chair: Mr. Phil Kaszuba and Dr. Pai Tangyunyong

Space Application and Energy - POSTERS
Session Chair: Dr. Zachary Lingley and Mr. John Bescup

4:30 PM-5:20 PM


Board and System Level FA
Session Chair: Mr. Jason Wheeler and Ms. Becky Holdford

4:30 PM-5:45 PM


Fault Isolation II
Session Chair: Mr. Dan Bodoh and Dr. Jesse Alton

Thursday, November 14, 2019

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8:00 AM-10:05 AM


Sample Preparation and Device Deprocessing

9:00 AM-9:25 AM


Invited Paper - Characterization of 16nm Logic Devices at Ultra-Low Voltage with Enhanced Material Contrast

9:25 AM-9:50 AM


FA Processes Case Studies
Session Chair: Dr. CHUAN ZHANG and Dr. ERWIN HENDARTO

10:05 AM-10:25 AM


Morning Refreshment Break

10:25 AM-12:05 PM


FA Processes Case Studies II
Session Chair: Dr. Chuan Zhang and Dr. Erwin Hendarto

Scanning Probe Analysis
Session Chair: Dr. Pai Tangyunyong and Mr. Phil Kaszuba

12:05 PM-2:05 PM


Lunch/Contactless Probing and Nanoprobing User Group
Session Chair: Mr. Dan Bockelman, Dr. Daminda Dahanayaka and Neel Leslie

Lunch/FIB User Group
Session Chair: Mr. Steven B. Herschbein, Mr. Michael Wong and Mary Coles

2:05 PM-2:30 PM


Invited Paper - Testing requirements for emerging single-chip cryogenic mixed-signalquantum processors in production FDSOI CMOS technology
Session Chair: Dr. Felix Beaudoin

2:05 PM-2:55 PM


Low Power Devices Case Studies
Session Chair: Dr. Mike Bruce and Ms. Rose Ring

2:30 PM-4:10 PM


Product Yield, Test & Diagnostics
Session Chair: Mr. Jayant DSouza and Mr. Amit Jakati

2:55 PM-3:45 PM


Mixed Mode & High Power Devices Case Studies
Session Chair: Mr. Stephen Fasolino and Mr. Jeff Gambino