Contact Leakage Failure Analysis by EBIC, C-AFM and Nano-probing

Wednesday, November 13, 2019
Exhibit Hall D (Oregon Convention Center)
Mr. Kuang-Tse Ho , Materials Analysis Technology, Hsinchu City, Taiwan
Dr. Chien-Wei wu , Materials Analysis Technology, Hsinchu City, Taiwan
Dr. Te-Fu Chang , Materials Analysis Technology, Hsinchu City, Taiwan
Mr. Chia-Hsiang Yen , Materials Analysis Technology, Hsinchu City, Taiwan
Mr. Ching-Hsiang Chan , Materials Analysis Technology, Hsinchu City, Taiwan

Summary:

In this paper, all possible contact leakage mechanisms are presented and associated FA procedures are proposed. Following the flow, all device-related defects inducing leakage can be identified by EBIC, C-AFM and nano-probing and verified by SEM, FIB and TEM examination.
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