Advanced 3D localization in Lock-In Thermography based on the analysis of the TRTR (Time-Resolved Thermal Response) received upon arbitrary waveform stimulation

Monday, November 11, 2019: 2:00 PM
F 150/151 (Oregon Convention Center)
Dr. Sebastian Brand , Fraunhofer Institute for Microstructure of Materials and Systems IMWS, Halle, Germany
Mr. Michael Kögel , Fraunhofer Institute for Microstructure of Materials and Systems IMWS, Halle, Germany
Mr. Christian Grosse , Fraunhofer Institute for Microstructure of Materials and Systems IMWS, Halle, Germany
Ms. Bernice Zee , Advanced Micro Devices (AMD), Singapore, Singapore
Ms. Qiu Wen , Advanced Micro Devices (AMD), Singapore, Singapore
Mr. Brian Lai , Thermo Fisher Scientific, Fremont, CA
Ms. Qingqing Wang , Thermo Fisher Scientific, Fremont, CA
Dr. Jim Vickers , Thermo Fisher Scientific, Fremont, CA
Mr. David Tien , Thermo Fisher Scientific, Fremont, CA
Mr. FRANK ALTMANN , Fraunhofer Institute for Microstructure of Materials and Systems IMWS, Halle, Germany

Summary:

3D-defect localization by LIT by broad band extended excitation using arbitrary waveform stimulation. the paper reports on the evaluation and validation of the method and presents case studies.
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