3D Device Failure Analysis
Monday, November 11, 2019: 2:00 PM-2:50 PM
F 150/151 (Oregon Convention Center)
Dr. Christian Schmidt, Nvidia and Kristofor Dickson, NXP
2:00 PM
Advanced 3D localization in Lock-In Thermography based on the analysis of the TRTR (Time-Resolved Thermal Response) received upon arbitrary waveform stimulation
Dr. Sebastian Brand, Fraunhofer Institute for Microstructure of Materials and Systems IMWS;
Mr. Michael Kögel, Fraunhofer Institute for Microstructure of Materials and Systems IMWS;
Mr. Christian Grosse, Fraunhofer Institute for Microstructure of Materials and Systems IMWS;
Ms. Bernice Zee, Advanced Micro Devices (AMD);
Ms. Qiu Wen, Advanced Micro Devices (AMD);
Mr. Brian Lai, Thermo Fisher Scientific;
Ms. Qingqing Wang, Thermo Fisher Scientific;
Dr. Jim Vickers, Thermo Fisher Scientific;
Mr. David Tien, Thermo Fisher Scientific;
Mr. FRANK ALTMANN, Fraunhofer Institute for Microstructure of Materials and Systems IMWS
