45th International Symposium for Testing and Failure Analysis (Nov. 10-14, 2019)
November 10 - 14, 2019
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Variable angle TEM grid holder for advanced TEM lamellae preparation
Tuesday, November 12, 2019: 1:25 PM
F 150/151 (Oregon Convention Center)
Dr. Tomas Hrncir
,
TESCAN Brno s.r.o., Brno, Czech Republic
Mr. Marek Sikula
,
TESCAN Brno s.r.o., Brno, Czech Republic
Dr. Pavel Dolezel
,
TESCAN Brno s.r.o., Brno, Czech Republic
Dr. Claudio A. G. Savoia
,
STmicroelectronics, Agrate Brianza, Italy
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FIB Sample Preparation
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Technical Program