Conductice-Dissipative-Isolating - Do the actual limits in process equipment meet the requirements of ESD-sensitive devices?
Conductice-Dissipative-Isolating - Do the actual limits in process equipment meet the requirements of ESD-sensitive devices?
Wednesday, November 13, 2019: 8:00 AM
D 137/138 (Oregon Convention Center)
Summary:
In order to avoid in-process ESD (electrostatic discharge) from charged devices (CDM, charged device model), it is necessary to convert hard discharge (short-time-spark)into a soft discharge (smooth, longer time corona-like discharge), which can be better absorbed by chip-internal ESD protection. This is achieved by using electrostatic dissipative (high-ohmic) materials at dedicated places in process equipment. The limits between conductive, dissipative and isolating materials are defined by international ESD standards. However, surprising exeriments and results show that existing limits are too deep and may cause hard discharge risks to ESD sebnsitive devices
In order to avoid in-process ESD (electrostatic discharge) from charged devices (CDM, charged device model), it is necessary to convert hard discharge (short-time-spark)into a soft discharge (smooth, longer time corona-like discharge), which can be better absorbed by chip-internal ESD protection. This is achieved by using electrostatic dissipative (high-ohmic) materials at dedicated places in process equipment. The limits between conductive, dissipative and isolating materials are defined by international ESD standards. However, surprising exeriments and results show that existing limits are too deep and may cause hard discharge risks to ESD sebnsitive devices