Packaging & Assembly

Wednesday, November 13, 2019: 8:00 AM-9:40 AM

D 137/138 (Oregon Convention Center)

Ms. Kannu Wadhwa, ZEISS and Dr. Peng Li, Intel Corp.

8:00 AM

Conductice-Dissipative-Isolating - Do the actual limits in process equipment meet the requirements of ESD-sensitive devices?
Prof. Peter Jacob, EMPA Duebendorf (50%, 1993-today, Main Affiliation); Mr. Albert Kunz, EMPA Swiss Federal Laboratories for Materials Testing and Research

8:25 AM

Study of thermal cycle induced CPI failure mode in a lidded FC-BGA package
Dr. Muhammad Morshed, GLOBALFOUNDRIES; Dr. Anita Madan, GLOBALFOUNDRIES; Ms. Esther P.Y. Chen, GLOBALFOUNDRIES Inc.

8:50 AM

Novel x-ray microscopic chemical imaging for rapid non-destructive identification of microbump voids and compositional defects
Mr. S.H. Lau, Sigray, Inc.; Dr. Benjamin Stripe, Sigray, Inc.; Ms. Sylvia Lewis, Sigray, Inc.; Ms. Xiaolin Yang, Sigray, Inc.; Dr. Wenbing Yun, PhD, Sigray, Inc.

9:15 AM

Isolating an Open in 2.5D µBump & Chip Bump Chains using SDR, EBAC and Capacitive Measurements
Mr. Kevin A. Distelhurst, BS/MS Electrical Engineering, GLOBALFOUNDRIES; Mr. Doug B. Hunt, GLOBALFOUNDRIES; Mr. Daniel A. Bader, GLOBALFOUNDRIES

See more of: Technical Program